ELECTROSTATIC CHUCK, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE PROCESSING METHOD

• Main Authors: KO HYUN-TAK, LEE SANG-KI
• Format: Patent
• Language: Chinese; English
• Published: 19.11.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses an electrostatic chuck, a substrate processing apparatus, and a substrate processing method. A heat transfer layer using a heat transfer fluid is disposed between a chuck main body disposed at an upper side of the electrostatic chuck and a chuck base disposed at a lower side of the electrostatic chuck, and the chuck main body is simply placed on the chuck base so as to be physically in contact with the heat transfer layer, such that heat may be stably transferred without damage even in a condition in which the heat transfer layer is at a high temperature, and the chuck main body may be easily separated from the chuck base for maintenance. 本发明公开一种静电卡盘、基板处理装置以及基板处理方法。本发明在上侧的卡盘主体和下侧的卡盘底座之间配置利用导热流体的导热层，只是将卡盘主体放置于卡盘底座上以卡盘主体与导热层物理接触，因此导热层在高温条件下也能够无损坏且稳定地执行导热，为了维护，能够将卡盘主体从卡盘底座容易地分离。