Vapor chamber plate degassing port forming process
The invention relates to the field of thermal conductance, in particular to a vapor chamber plate degassing port forming process. The process comprises the following steps of material plate forming in a whole plate, leveling and adhesive dispensing, wherein the whole plate degassing port forming pro...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
19.11.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The invention relates to the field of thermal conductance, in particular to a vapor chamber plate degassing port forming process. The process comprises the following steps of material plate forming in a whole plate, leveling and adhesive dispensing, wherein the whole plate degassing port forming process is completed in a vapor chamber stamping device. The vapor chamber stamping device is provided with a precise positioning structure, and a detection through hole and a barometer which are used for detecting the positioning precision and the density of the vapor chamber, whole-plate production of the vapor chamber is achieved, and the production efficiency and the product quality are improved.
本发明涉及热导领域,具体涉及一种均温板板料除气口成型工艺,包括以下步骤:整板成型料板、整平和点胶,其中整板除气口成型工艺在均热板冲压装置中完成,均热板冲压装置带有精准定位结构以及用于检测定位精准度和均热板密度的检测通孔及气压计,实现了均温板的整板生产,提高生产效率和产品品质。 |
---|---|
Bibliography: | Application Number: CN202111019198 |