Novel efficient electroplating convenient device

• Main Authors: PENG HONGJUN, DING HUIMEI, YANG XIYUN, YUAN XIAOJU, HE AIZHI, DING RONGJUN
• Format: Patent
• Language: Chinese; English
• Published: 19.11.2021
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention relates to the technical field of electroplating processing equipment, in particular to a novel efficient electroplating convenient device. According to the technical scheme, the novel efficient electroplating convenient device comprises a cylindrical main body electroplating safe and stable connecting column with the center axis in the vertical direction, and an integrally-formed first matched connecting mounting column is arranged on the left side of the outer cylindrical face of the main body electroplating safe and stable connecting column; the lower end face of the first matched connection mounting column and the lower end face of the main body electroplating safe and stable connecting column are located on the same plane, and the width of the left side position of the first matched connection mounting column in the front-back direction is smaller than that of the right side position in the front-back direction. The right side of the outer cylindrical surface of the main body electroplating