THERMALLY CONDUCTIVE SILICONE POTTING COMPOSITION

• Main Authors: XING WENTAO, WANG YUANXUN, QIU XUEYU, ZHANG XINYU, ZHU XU, WU HAO
• Format: Patent
• Language: Chinese; English
• Published: 16.11.2021
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention discloses a thermally conductive silicone potting composition. The thermally conductive silicone potting composition comprises: a first part comprising: (a) a vinyl organopolysiloxane, (c) an alumina filler having an average particle diameter which is greater than or equal to 0.1 [Mu]m and less than 3 [Mu]m, (d) an alumina and/or aluminium hydroxide filler having an average particle diameter which is greater than or equal to 3 [Mu]m and less than 15 [Mu]m, (e) an alumina filler having an average particle diameter which is greater than or equal to 15 [Mu]m and less than or equal to 100 [Mu]m, (f) a catalyst, and a second part comprising: (b) a hydride organopolysiloxane, (c), (d) and (e). The thermally conductive silicone potting composition shows a good balance among flowability, thermal conductivity and storage stability. A thermal potting adhesive, a use of the thermally conductive silicone potting composition in an electronic component, and an electronic component are further disclosed. 本发明公开