Method for setting thickness of copper layer of copper-clad steel

The invention relates to the technical field of grounding engineering, and aims to provide a method for setting the thickness of a copper layer of copper-clad steel. The invention discloses a method for setting the thickness of a copper layer of copper-clad steel. The method comprises the steps: obt...

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Bibliographic Details
Main Author HE HUALIN
Format Patent
LanguageChinese
English
Published 05.11.2021
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
CURRENT COLLECTORS
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
LINE CONNECTORS
PHYSICS
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Summary:The invention relates to the technical field of grounding engineering, and aims to provide a method for setting the thickness of a copper layer of copper-clad steel. The invention discloses a method for setting the thickness of a copper layer of copper-clad steel. The method comprises the steps: obtaining first copper layer thickness meeting the electrical performance requirement; obtaining the designed service life of the copper-clad steel; acquiring the soil corrosion rate of the current copper-clad steel grounding area; according to the designed service life of the copper-clad steel and the soil corrosion rate of the current copper-clad steel grounding area, obtaining second copper layer thickness meeting the corrosion resistance requirement; and according to the first copper layer thickness and the second copper layer thickness, obtaining final copper layer thickness, wherein the final copper layer thickness is equal to the sum of the first copper layer thickness and the second copper layer thickness. Acc
Bibliography:Application Number: CN202110903641