COOLING OF ELECTRONIC COMPONENTS WITH AN ELECTROHYDRODYNAMIC FLOW UNIT

• Main Authors: NELSON PETER, THORSLUND ROBERT, BJORNEKLETT ARE
• Format: Patent
• Language: Chinese; English
• Published: 02.11.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

An arrangement (100) for thermal management is disclosed, wherein a heat generating component (110) is arranged within an enclosure (120), defined by an enclosure wall (121 ) and in thermal contact with a thermal management fluid (130). The arrangement comprises an electrohydrodynamic flow unit (140...