COOLING OF ELECTRONIC COMPONENTS WITH AN ELECTROHYDRODYNAMIC FLOW UNIT

An arrangement (100) for thermal management is disclosed, wherein a heat generating component (110) is arranged within an enclosure (120), defined by an enclosure wall (121 ) and in thermal contact with a thermal management fluid (130). The arrangement comprises an electrohydrodynamic flow unit (140...

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Bibliographic Details
Main Authors NELSON PETER, THORSLUND ROBERT, BJORNEKLETT ARE
Format Patent
LanguageChinese
English
Published 02.11.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:An arrangement (100) for thermal management is disclosed, wherein a heat generating component (110) is arranged within an enclosure (120), defined by an enclosure wall (121 ) and in thermal contact with a thermal management fluid (130). The arrangement comprises an electrohydrodynamic flow unit (140), comprising a first and a second electrode(140a, 140b), for controlling the flow (F) of fluid within the enclosure. 披露了一种用于热管理的装置(100)，其中，发热部件(110)布置在由外壳壁(121)限定的外壳(120)内并且与热管理流体(130)处于热接触。该装置包括电流体动力学流动单元(140)，该电流体动力学流动单元包括第一和第二电极(140a，140b)，用于控制流体在外壳内的流动(F)。
Bibliography:Application Number: CN202080020039