Atomic layer deposition device

• Main Authors: SHAO HUACHEN, XIANG JUNREN, LIU XIAO, YI GE, CHEN RONG, LI JIAWEI
• Format: Patent
• Language: Chinese; English
• Published: 29.10.2021
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention relates to an atomic layer deposition device, a reaction chamber comprises a reaction chamber main body and a cavity door, a reaction cavity is formed in the reaction chamber main body, the reaction chamber main body is provided with an air inlet and an air extraction opening, and the cavity door is detachably connected with the reaction chamber main body; a mounting frame is fixedly connected with the cavity door, and when the cavity door is connected with the reaction chamber main body, the mounting frame is positioned inside the reaction cavity; a first bearing part is used for bearing a block-shaped to-be-coated object, and the first bearing part is detachably connected with the mounting frame; a second bearing part is used for bearing a powdery to-be-coated object, and the second bearing part is detachably connected with the mounting frame; in the first use state, the first bearing part is fixedly connected with the mounting frame; and in the second use state, the second bearing part is con