ELECTRICAL CONNECTION APPARATUS

• Main Authors: HAYASHIZAKI TAKAYUKI, KON MIZUHO, NARITA TOSHIO, AKAHIRA AKIHISA, SUDO KENICHI
• Format: Patent
• Language: Chinese; English
• Published: 22.10.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

An electrical connection device (1) is provided with a probe (10) and a probe head (20) including a middle guide plate (23) which is disposed between a top guide plate (21) and a bottom guide plate (22) closer to the bottom guide plate (22), and through which the probe (10) penetrates. The top guide plate (21) and the middle guide plate (23) have guide holes for passing the probe (10) which are positioned differently such that the probe (10) is held in a state of being curved between the top guide plate (21) and the middle guide plate (23). The probe (10) is structured to bend more readily in regions other than a maximum stress portion where the stress that acts on the probe (10) buckling as the tip-end portion thereof contacts a body to be inspected is at a maximum. 电连接装置(1)包括探针(10)和探针头(20)，该探针头(20)具有中部引导板(23)，该中部引导板(23)在顶部引导板(21)与底部引导板(22)之间靠近底部引导板(22)地配置，并且供探针(10)贯穿。供探针(10)贯穿的引导孔的位置在顶部引导板(21)和中部引导板(23)中偏移地设置，以在顶部引导板(21)与中部引导板(23)之间弯曲的状态保持探针(10)。探针(10)具有如下的构造：与在通过顶端部与被检体接触而压曲的探针(10)施加的应力最大的最大应力位置相比，在除了最大应力位