Processing method of rigid-flex board with multiple surface treatment processes in flexible board area

• Main Authors: LIU CHANGSONG, WEN WEIFENG, GUO DAWEN, ZENG LONG
• Format: Patent
• Language: Chinese; English
• Published: 22.10.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to a processing method of a rigid-flex board with multiple surface treatment processes in a flexible board area, which comprises the following steps of: printing a layer of protective ink on a'welded PAD needing to be coated with a protective film' in advance after the inner layer of the flexible board is processed and the board surface is flat, so as to protect the welded PAD; when the rigid-flex board is pressed, only reserving the rigid board area of the flowing prepreg layer, hollowing out the flexible board area along the uncovering line, covering the flexible board area with the outer rigid board layer, after the rigid-flex board is uncovered, exposing the flexible board area, and plating gold on the finger PAD; cleaning the protective ink, and forming a layer of organic protective film on the welding PAD needing to be coated with the protective film; and finally, forming two kinds of surface treatment in the flexible board area of the rigid-flex board. The method is high in practi