SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: BAEK SEUNG-DAE, KIM SEONG-HWA, KIM SUNG-YUP, KIM NAM-JIN, SON JAE-HWAN
• Format: Patent
• Language: Chinese; English
• Published: 22.10.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes: a chamber part; an operation table part arranged in the cavity part; a rotating shaft part which is rotatably mounted on the operation table part and enables the substrate placed on the rotating shaft part to rotate; and a drying part which is assembled in the chamber part and is arranged above the substrate so as to supply a drying fluid to the chamber part, so that the working environment of the chamber part can be quickly optimized. 本发明涉及基板处理装置以及基板处理方法。该基板处理装置包括：腔室部；内置于腔室部的操作台部；转轴部，以可旋转方式安装于操作台部并且使放置于转轴部的基板旋转；以及干燥部，组装于腔室部并且配置于基板的上方，以向腔室部供给干燥用流体，从而能够迅速地优化腔室部的作业环境。