Bonding material with high elongation at break and preparation method thereof

• Main Author: CHEN TIANZHU
• Format: Patent
• Language: Chinese; English
• Published: 19.10.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

The invention provides a bonding material with high elongation at break and a preparation method thereof, and the bonding material comprises the following components in parts by weight: 90-100 parts of high-flexibility epoxy resin and 30-50 parts of a modified curing agent. Wherein the high-flexibility epoxy resin comprises 90-95 parts of basic epoxy resin and 50-75 parts of a phenolic hydroxyl material. The modified curing agent is prepared from 20 to 30 parts of basic fatty amine, 20 to 30 parts of aromatic amine, 15 to 25 parts of long carbon chain glycidyl ether and 15 to 25 parts of six-membered ring glycidyl ether. The preparation method comprises the following steps: mixing basic epoxy resin and a phenolic hydroxyl material for reaction, and then adding a catalyst for reaction to obtain high-flexibility epoxy resin; then mixing aliphatic amine and aromatic amine to obtain a mixed amine solution, and mixing long carbon chain glycidyl ether and six-membered ring glycidyl ether to obtain a glycidyl ether