Low-temperature solder paste material with metal coating carbon nano tube reinforcement and preparation method of low-temperature solder paste material

• Main Authors: ZHANG ZHIYU, LUO LIWEI, LIN XIAOLU, LIN XIANG
• Format: Patent
• Language: Chinese; English
• Published: 12.10.2021
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention belongs to the technical field of brazing, and relates to a low-temperature solder paste material and a preparation method thereof. The preparation method of the low-temperature solder paste material comprises the steps that a copper-plated or silver-plated carbon nano tube prepared by adopting a polymer-assisted metal atom electroless chemical deposition method is added into SnBi-based low-temperature solder powder, after ball-milling and uniform mixing, the mixture is added into SnBi-based low-temperature solder alloy melt, after ultrasonic mixing, standing, powder blowing and smelting, SnBi-based low-temperature solder alloy powder is obtained, and the SnBi-based low-temperature solder alloy powder and soldering flux are mixed uniformly. According to the method, on the basis of uniformity of a copper layer and a silver layer and good wettability of a tin-copper or tin-silver interface, the copper-plated or silver-plated carbon nano tube obtains good dispersity in a tin-bismuth alloy matrix, t