Wafer bonding method and system

• Main Author: TIAN YINGCHAO
• Format: Patent
• Language: Chinese; English
• Published: 08.10.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a wafer bonding method and system, and the method comprises the steps: enabling a device wafer and a film stretching ring to be fixed, binding an identifier of the film stretching ring with an identifier of the device wafer, and completing the bonding of the device wafer on a plurality of machines until qualified chips in the device wafer are respectively bonded to a target wafer, wherein as the identification of the film stretching ring can be prepared in a laser marking mode, the technology in the bonding step can be compatible, paper labels do not need to be pasted on the film stretching ring or the device wafer, each machine table can identify the device wafer by identifying the identification of the film stretching ring, after bonding of the device wafer is completed, the identification of the film stretching ring is unbound with the identification of the device wafer, the film stretching ring can be recycled and reused, and waste of raw materials is avoided. 本发明提供了一种晶圆的键合方法及系统，将器件