Resin composition, and manufacturing method thereof, resin film and metal-clad laminate

• Main Authors: NISHIYAMA TEPPEI, SUZUKI TOMOYUKI, FUJIMA ORIHIDO, HIRAISHI KATSUFUMI, KAKIZAKA KOTA
• Format: Patent
• Language: Chinese; English
• Published: 01.10.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

The invention provides a resin composition, a manufacturing method thereof, a resin film and a metal-clad laminate, wherein a liquid crystal polymer filler is dispersed in polyimide, and the resin composition has excellent dielectric properties and dimensional stability. A resin composition containi...