Resin composition, and manufacturing method thereof, resin film and metal-clad laminate

• Main Authors: NISHIYAMA TEPPEI, SUZUKI TOMOYUKI, FUJIMA ORIHIDO, HIRAISHI KATSUFUMI, KAKIZAKA KOTA
• Format: Patent
• Language: Chinese; English
• Published: 01.10.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

The invention provides a resin composition, a manufacturing method thereof, a resin film and a metal-clad laminate, wherein a liquid crystal polymer filler is dispersed in polyimide, and the resin composition has excellent dielectric properties and dimensional stability. A resin composition containing (A) a polyamic acid obtained by reacting a tetracarboxylic acid anhydride component and a diamine component, and (B) a filler containing a liquid crystal polymer and having shape anisotropy. It is preferable that the ratio of the average major axis diameter to the average minor axis diameter of the filler as component (B) is within the range of 3-200, the average major axis diameter of the filler as component (B) is within the range of 50-3000 [mu]m, and the average minor axis diameter is within the range of 1-50 [mu]m. In the resin film obtained from the resin composition, the polyimide layer contains polyimide and a filler which contains a liquid crystal polymer and has shape anisotropy and is dispersed in the