POLYIMIDE FIBER PAPER USING NON-THERMOPLASTIC POLYMER

• Main Authors: TAKAHASHI NARUAKI, MACHIDA HIDEAKI, UETA GEN
• Format: Patent
• Language: Chinese; English
• Published: 28.09.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CONDUCTORS; ELECTRICITY; IMPREGNATING OR COATING OF PAPER; INSULATORS; PAPER NOT OTHERWISE PROVIDED FOR; PAPER-MAKING; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; PRODUCTION OF CELLULOSE; PULP COMPOSITIONS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TEXTILES; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G

As far as the characteristic properties of films are concerned, there are limits to the thermal insulation and gas/liquid permeability properties of polyimide films, and thus there has been anticipation for the development of a flexible sheetlike product that improves these characteristic properties while making the most of the high functionality of polyimides. Additionally, when polyimide films are made thicker, ordinarily this leads to higher cost as well as to an increase in weight, and thus there is demand for the development of a polyimide sheetlike product that is thick and lightweight at low cost. [Means for solving this problem] In order to solve this problem, the present invention provides a manufacturing method for a polyimide fiber paper intermediate structure X, said manufacturing method comprising: a short fiber preparation step in which shaved short fibers of a non-thermoplastic polyimide are prepared; and an intermediate structure X formation step in which the polyimide fiber paper intermediate