Copper plating method for 0Cr15Ni25Ti2MoAlVB stainless steel surface

• Main Authors: LIU ZHENBAO, YANG ZHIYONG, YANG LIANG, YANG YUJUN, WANG CHANGJUN, HOU SHAOLIN, YU TENG, QI CHAO, CHOU YINGYU, SUN YONGQING, LIANG JIANXIONG
• Format: Patent
• Language: Chinese; English
• Published: 28.09.2021
• Subjects: APPARATUS THEREFOR; CHEMICAL SURFACE TREATMENT; CHEMISTRY; CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS

The invention discloses a copper plating method for a 0Cr15Ni25Ti2MoAlVB stainless steel surface, which belongs to the technical field of copper plating, and solves the problems that oxalate is adopted as a 0Cr15Ni25Ti2MoAlVB stainless steel plating layer in the prior art, so that the plating layer is easy to fall off and loses a lubricating effect, and an oxidation film cannot be cleaned up before copper plating on the 0Cr15Ni25Ti2MoAlVB stainless steel surface to result poor quality of the plating layer. The method comprises the following steps that electrolytic degreasing, primary acid pickling, secondary acid pickling, activation, pretreatment and copper plating are sequentially conducted on the 0Cr15Ni25Ti2MoAlVB stainless steel surface; the secondary acid pickling comprises the following steps that the secondary acid pickling is conducted on the 0Cr15Ni25Ti2MoAlVB stainless steel surface subjected to the primary acid pickling, and a secondary acid pickling solution comprises 100-150 ml/L of HCl and 0.5-