Epoxy group heat conduction adhesive and preparation method thereof

Belonging to the technical field of adhesive materials, the invention discloses an epoxy group heat conduction adhesive, which is prepared from the following substances by weight: 55-65 parts of epoxy resin, 4-7 parts of a curing agent, 2-5 parts of a plasticizer, 1-4 parts of a diluent, 1-2 parts o...

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Bibliographic Details
Main Authors LIN HAIHUI, XU JIAPENG
Format Patent
LanguageChinese
English
Published 24.09.2021
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:Belonging to the technical field of adhesive materials, the invention discloses an epoxy group heat conduction adhesive, which is prepared from the following substances by weight: 55-65 parts of epoxy resin, 4-7 parts of a curing agent, 2-5 parts of a plasticizer, 1-4 parts of a diluent, 1-2 parts of a flame retardant, 0.5-1 part of a catalyst, and 8-12 parts of a modified filler. The adhesive is good in heat conduction effect, high in stability, simple in preparation method and easy to popularize and apply. 本发明公开了一种环氧基导热胶粘剂，属于胶粘剂材料技术领域，由如下对应重量份的物质制成：55～65份环氧树脂、4～7份固化剂、2～5份增塑剂、1～4份稀释剂、1～2份阻燃剂、0.5～1份催化剂、8～12份改性填料。本发明胶粘剂导热效果好、稳定性强，且制备方法简单，易于推广应用。
Bibliography:Application Number: CN202110796168