Micro-electro-mechanical system and manufacturing method thereof

• Main Authors: LIU XULUN, LYU WENXIONG, ZHUANG YONGHAN, LI MINGJI, ZHENG MINGDA, WU KAIDI
• Format: Patent
• Language: Chinese; English
• Published: 27.08.2021
• Subjects: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

A micro-electro-mechanical system (MEMS) includes a circuit substrate including an electronic circuit; a supporting substrate which is provided with a groove; a bonding layer disposed between the circuit substrate and the support substrate; a via through the circuit substrate to the opening; a first conductive layer which is arranged on the front side of the circuit substrate; a second conductive layer which is arranged on the inner wall of the groove; and a third conductive layer disposed on an inner wall of each of the through holes. In accordance with other embodiments of the present application, a method of manufacturing a micro-electro-mechanical system is also provided. 一种微机电系统(MEMS)包括：电路衬底，包括电子电路；支撑衬底，具有凹槽；接合层，设置在电路衬底和支撑衬底之间；通孔，穿过电路衬底到达开口；第一导电层，设置在电路衬底的前侧；第二导电层，设置在凹槽的内壁上；以及第三导电层，设置在每个通孔的内壁上。根据本申请的其他实施例，还提供了制造微机电系统的方法。