HYBRID PANEL METHOD OF MANUFACTURING ELECTRONIC DEVICES AND ELECTRONIC DEVICES MANUFACTURED THEREBY

• Main Authors: TEIXEIRA FERNANDO, O'TOOLE EOIN, DA SILVA JOSE MOREIRA, HUEMOELLER RONALD, SILVA JOSE LUIS, BALOGLU BORA, JAYARAMAN SURESH, SA SANTOS MARTA, ALVES LUIS, CARDOSO ANDRE
• Format: Patent
• Language: Chinese; English
• Published: 24.08.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel. 一种制造电子装置的混合面板方法(和设备)，以及由此制造的电子装置。作为非限制性示例，本公开的各个方面提供了一种用于制造半导体装置的设备，其中该设备可操作以至少：接收与多个子面板耦合的面板，所述多个子面板包括第一子面板；通过一层材料在所述第一子面板周围切割；以及从所述面板移除所述第一个子面板。