Refrigeration and heat preservation compartment semiconductor refrigeration device and system

• Main Authors: SONG JUN, SU JIANJUN, LIAO CHUNJIE, ZENG JINLIANG, LI HANPEI, LI YONGQING, WANG LIANHAO
• Format: Patent
• Language: Chinese; English
• Published: 24.08.2021
• Subjects: BLASTING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; HEATING; LIGHTING; LIQUEFACTION SOLIDIFICATION OF GASES; MANUFACTURE OR STORAGE OF ICE; MECHANICAL ENGINEERING; PERFORMING OPERATIONS; REFRIGERATION MACHINES, PLANTS OR SYSTEMS; REFRIGERATION OR COOLING; TRANSPORTING; VEHICLES ADAPTED FOR LOAD TRANSPORTATION OR TO TRANSPORT, TOCARRY, OR TO COMPRISE SPECIAL LOADS OR OBJECTS; VEHICLES IN GENERAL; WEAPONS

The invention discloses a refrigeration and heat preservation compartment semiconductor refrigeration device and system. The refrigeration and heat preservation compartment semiconductor refrigeration device comprises a heat dissipation module, a compartment wall module and a refrigeration module, wherein the heat dissipation module comprises a radiator, a water pump, a water pipe and a water cooling plate, and control over the temperature of a hot end and circulation and heat dissipation of cooling water are guaranteed; the compartment wall module comprises a compartment wall main body, an outer skin, an inner skin and embedded iron, and a whole frame of the device is provided to guarantee convenient installation; the refrigeration module comprises semiconductor refrigeration sheets and a cold dissipation fin, and plays a role in refrigeration; and the radiator is located at the outer portion of a compartment, the inner and outer skins are located on a compartment wall, the cold dissipation fin is located in