DEVICE COMPRISING FIRST SOLDER INTERCONNECTS ALIGNED IN A FIRST DIRECTION AND SECOND SOLDER INTERCONNECTS ALIGNED IN A SECOND DIRECTION

• Main Authors: WANG HOWARD, LANGARI ABDOLREZA, HUANG CHING-LIOU, GANGULY SUJOY, JANG TAEHEE, LI YUFU
• Format: Patent
• Language: Chinese; English
• Published: 20.08.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A device that includes a first die and a package substrate. The package substrate includes a dielectric layer, a plurality of vias formed in the dielectric layer, a first plurality of interconnects formed on a first metal layer of the package substrate, and a second plurality of interconnects formed on a second metal layer of the package substrate. The device includes a first series of first solder interconnects arranged in a first direction, the first series of first solder interconnects configured to provide a first electrical connection; a second series of first solder interconnects arranged in the first direction, the second series of first solder interconnects configured to provide a second electrical connection; a first series of second solder interconnects arranged in a second direction, the first series of second solder interconnects configured to provide the first electrical connection. 一种器件，其包括第一管芯和封装基板。该封装基板包括介电层、形成在该介电层中的多个通孔、形成在该封装基板的第一金属层上的第一多个互连、以及形成在该封装基板的第二金属层上的第二多个互连。该器件包括：布置在第一方向上的第一系列第一焊料互