Modular heat preservation structure convenient to disassemble and assemble

• Main Author: LIU QIUTONG
• Format: Patent
• Language: Chinese; English
• Published: 17.08.2021
• Subjects: BLASTING; ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; HEATING; JOINTS OR FITTINGS FOR PIPES; LIGHTING; MEANS FOR THERMAL INSULATION IN GENERAL; MECHANICAL ENGINEERING; PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; THERMAL INSULATION IN GENERAL; WEAPONS

The invention provides a modular heat preservation structure convenient to disassemble and assemble. The modular heat preservation structure convenient to disassemble and assemble comprises at least one heat preservation unit and at least one connecting unit; each heat preservation unit comprises a high-temperature-resistant layer, a heat insulation layer and a protective layer which are sequentially arranged from inside to outside; at least one opposite sides of each heat preservation unit are provided with a first splicing part and a second splicing part which are matched with each other; and the connecting unit is arranged on the heat preservation unit and can cover the splicing position of the first splicing part and the second splicing part, so that the heat preservation unit can be fixed to the surface of a part to be subjected to heat preservation in a wrapping mode. Through adoption of the modular heat preservation structure, the mounting applicability is improved, the good attachment degree with the