Clamping mechanism for smearing conductive paste on wire clamp

• Main Authors: MAO SHUIQIANG, CHEN YIPING, FENG YONGBING, MA XINHUA, LI HENGXUAN, CHENG HUIYANG, ZHU GANG, LIN JUNCEN, LIU XIN, CHEN DONG, HUANG WEIJIN, ZHENG HENG, HU XIONGWEI
• Format: Patent
• Language: Chinese; English
• Published: 10.08.2021
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; PERFORMING OPERATIONS; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

The invention discloses a clamping mechanism for smearing conductive paste on a wire clamp. The clamping mechanism comprises a left baffle, an upper baffle and a right baffle, a height adjusting mechanism comprises a thrust air cylinder and a lower baffle, a width adjusting mechanism is arranged on the left baffle or/and the right baffle, a clamping air cylinder is connected to the width adjusting mechanism, and a smearing opening is formed in the upper baffle. The mechanism has the advantages that the wire clamp is fixed between the lower baffle and the upper baffle through the thrust air cylinder, the wire clamp is always subjected to acting force of the thrust air cylinder in the vertical direction during smearing, so that the wire clamp is not interfered by smearing pressure during smearing, the surface of the wire clamp is always in a horizontal state, therefore, the uniformity of the smearing thickness of the conductive paste is effectively guaranteed, secondly, the width of a cavity is adjusted through