SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
A semiconductor package includes an interposer, a die, and an encapsulant. Each die includes an active surface, a back side surface, and a side surface. The backside surface is opposite the active surface. The side surface bonds the active surface to the backside surface. The encapsulant includes a...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
03.08.2021
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Subjects | |
Online Access | Get full text |
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