SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: HUANG SONGHUI, SHEN WENWEI, HOU SHANGYONG, HUANG GUANYU
• Format: Patent
• Language: Chinese; English
• Published: 03.08.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package includes an interposer, a die, and an encapsulant. Each die includes an active surface, a back side surface, and a side surface. The backside surface is opposite the active surface. The side surface bonds the active surface to the backside surface. The encapsulant includes a...