SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
A semiconductor package includes an interposer, a die, and an encapsulant. Each die includes an active surface, a back side surface, and a side surface. The backside surface is opposite the active surface. The side surface bonds the active surface to the backside surface. The encapsulant includes a...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
03.08.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor package includes an interposer, a die, and an encapsulant. Each die includes an active surface, a back side surface, and a side surface. The backside surface is opposite the active surface. The side surface bonds the active surface to the backside surface. The encapsulant includes a first material and laterally encapsulates the die. The dies are electrically connected to and disposed side-by-side on the interposer with respective backside surfaces facing away from the interposer. The at least one die includes an outer corner. A fillet structure is formed at the outer corner. The fillet structure includes a second material different from the first material. An outer corner is formed by a backside surface and a pair of adjacent side surfaces of the at least one die. The side surfaces of a pair of adjacent side surfaces have a common first edge. Each side surface of a pair of adjacent side surfaces does not face the other die and has a second edge common to the backside surface of at least one di |
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Bibliography: | Application Number: CN202010946031 |