SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: HUANG SONGHUI, SHEN WENWEI, HOU SHANGYONG, HUANG GUANYU
• Format: Patent
• Language: Chinese; English
• Published: 03.08.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package includes an interposer, a die, and an encapsulant. Each die includes an active surface, a back side surface, and a side surface. The backside surface is opposite the active surface. The side surface bonds the active surface to the backside surface. The encapsulant includes a first material and laterally encapsulates the die. The dies are electrically connected to and disposed side-by-side on the interposer with respective backside surfaces facing away from the interposer. The at least one die includes an outer corner. A fillet structure is formed at the outer corner. The fillet structure includes a second material different from the first material. An outer corner is formed by a backside surface and a pair of adjacent side surfaces of the at least one die. The side surfaces of a pair of adjacent side surfaces have a common first edge. Each side surface of a pair of adjacent side surfaces does not face the other die and has a second edge common to the backside surface of at least one di