MASKING FILM FOR PROTECTING SENSITIVE SUBSTRATES

• Main Authors: DESAI BANKIM BHUPENDRA, BRADY KEVIN A, RAY CARL DOUGLAS, JONES GREGORY K, PARKER STEVEN
• Format: Patent
• Language: Chinese; English
• Published: 30.07.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PAINTS; PERFORMING OPERATIONS; PHYSICS; POLISHES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

A masking film includes an adhesion layer that includes a blend of hydrogenated styrene block copolymer and low density polyethylene. The adhesion layer has an outer adhesion surface configured to contact a substrate. The outer adhesion surface has an average surface roughness Ra of between 100 nm and 350 nm, and an average spacing between peaks Sm of between 20 micrometers and 150 micrometers. The masking film also includes a release layer at a side of the adhesion layer opposite the outer adhesion surface. 一种掩蔽膜，其包含粘附层，该粘附层氢化苯乙烯嵌段共聚物和低密度聚乙烯的共混物。该粘附层具有经配置来接触基材的外粘附表面。该外粘附表面的平均表面粗糙度Ra是100nm至350nm，和平均峰间距Sm是20μm至150μm。该掩蔽膜还在该粘附层与该外粘附表面相对的一侧上包含离型层。