Vapor chamber, manufacturing method thereof and electronic equipment

The invention discloses a vapor chamber and a manufacturing method thereof and electronic equipment, the vapor chamber comprises a shell, a capillary channel is formed in the shell, and the depth of the capillary channel is gradually reduced from the position close to a heat source to the position f...

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Bibliographic Details
Main Authors SUN WANHUA, JIE HAIHUAN
Format Patent
LanguageChinese
English
Published 20.07.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention discloses a vapor chamber and a manufacturing method thereof and electronic equipment, the vapor chamber comprises a shell, a capillary channel is formed in the shell, and the depth of the capillary channel is gradually reduced from the position close to a heat source to the position far away from the heat source, so that the backflow speed of a liquid working medium channel is increased, and the situation that the vapor chamber is close to the heat source and has a liquid fault is prevented; and the heat dissipation power of the vapor chamber is enhanced. 本发明公开了一种均热板及其制作方法、电子设备，该均热板包括壳体，壳体内形成有毛细通道，毛细通道的深度由靠近热源处向远离热源处逐渐减小，从而提高了液态工质通道的回流速度，防止均热板靠近热源处出现液体断层，增强了均热板的散热功率。
Bibliography:Application Number: CN202110386382