Sensor
The invention provides a sensor. The sensor comprises a circuit substrate, a temperature sensing element and a pressure sensing module, the sensor is further provided with a flow channel located on the side where the second surface of the circuit substrate is located. The pressure sensing module is...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
13.07.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a sensor. The sensor comprises a circuit substrate, a temperature sensing element and a pressure sensing module, the sensor is further provided with a flow channel located on the side where the second surface of the circuit substrate is located. The pressure sensing module is located on the side where the second surface of the circuit substrate is located; the pressure sensing module comprises a pressure sensing element and a gel material; the pressure sensing element comprises a body part and a connecting part; the connecting part is electrically and physically connected with the body part, and the connecting part is electrically connected with the circuit substrate; the gel material covers at least part of the connecting part; at least part of the gel material is located between the connecting part and the channel; the temperature sensing element comprises a temperature sensing part and a conductive part; the temperature sensing part is positioned on the side of the second surface of |
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Bibliography: | Application Number: CN202110158013 |