ELECTRONIC DEVICE AND HEAT DISSIPATION ASSEMBLY THEREOF

An electronic device and a heat dissipation assembly are disclosed. The heat dissipation assembly includes a bottom plate, an outer cover, a heat guiding base, a flow-acceleration unit and two side cover sets. The bottom loads a heat-generating source. The outer cover includes a cover body and two s...

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Bibliographic Details
Main Authors HONG ZHENGZHANG, CAI YUQING, LIN QINGDA, CAO LYULONG
Format Patent
LanguageChinese
English
Published 09.07.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:An electronic device and a heat dissipation assembly are disclosed. The heat dissipation assembly includes a bottom plate, an outer cover, a heat guiding base, a flow-acceleration unit and two side cover sets. The bottom loads a heat-generating source. The outer cover includes a cover body and two slots. The cover body covers the bottom plate to define an accommodation space therebetween, and the slots are oppositely formed on the cover body and connected to the accommodation space. The heat guiding base thermally contacts the heat-generating source and the cover body, and is formed with voids arranged alongside, each of the voids is communication with the slots respectively. The side cover sets are disposed within the slots, respectively, and detachably connected to the cover body and the heat guiding base. The flow-acceleration unit is disposed in one of the side cover sets to lead a fluid to the other through the voids. 本发明公开一种电子装置及其散热组件，其中该散热组件包含一底板、一外盖、一热引导座、一引流单元与两个侧盖组。底板承载一发热源。外盖包含一盖体与两个开槽，盖体覆盖于底板的一面，并
Bibliography:Application Number: CN202010008714