Mounting table and plasma processing apparatus

The invention provides a mounting table and a plasma processing apparatus. A plurality of adhesive layers having different heights can be protected with one sealing member. The mounting table includes a first mounting portion, a second mounting portion, a first adhesive layer, a second adhesive laye...

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Bibliographic Details
Main Author SUGAWA NAOKI
Format Patent
LanguageChinese
English
Published 09.07.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Abstract The invention provides a mounting table and a plasma processing apparatus. A plurality of adhesive layers having different heights can be protected with one sealing member. The mounting table includes a first mounting portion, a second mounting portion, a first adhesive layer, a second adhesive layer, and a sealing member. The first mounting portion is used for mounting a substrate. The second placing portion is lower than the first placing portion and is used for placing an edge ring surrounding the periphery of the substrate. The first adhesive layer adheres a base and the first placing portion. The second adhesive layer adheres the base and the second placing portion. The sealing member is in contact with the first placing portion at a position above the first adhesive layer, is in contact with the second placing portion at a position above the second adhesive layer, and blocks a space between the first placing portion and the second placing portion by deformation. 本发明提供载置台和等离子体处理装置。能够用一个密封构件保护高度不同的多个粘接层。载
AbstractList The invention provides a mounting table and a plasma processing apparatus. A plurality of adhesive layers having different heights can be protected with one sealing member. The mounting table includes a first mounting portion, a second mounting portion, a first adhesive layer, a second adhesive layer, and a sealing member. The first mounting portion is used for mounting a substrate. The second placing portion is lower than the first placing portion and is used for placing an edge ring surrounding the periphery of the substrate. The first adhesive layer adheres a base and the first placing portion. The second adhesive layer adheres the base and the second placing portion. The sealing member is in contact with the first placing portion at a position above the first adhesive layer, is in contact with the second placing portion at a position above the second adhesive layer, and blocks a space between the first placing portion and the second placing portion by deformation. 本发明提供载置台和等离子体处理装置。能够用一个密封构件保护高度不同的多个粘接层。载
Author SUGAWA NAOKI
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DocumentTitleAlternate 载置台和等离子体处理装置
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Snippet The invention provides a mounting table and a plasma processing apparatus. A plurality of adhesive layers having different heights can be protected with one...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Mounting table and plasma processing apparatus
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