Mounting table and plasma processing apparatus
The invention provides a mounting table and a plasma processing apparatus. A plurality of adhesive layers having different heights can be protected with one sealing member. The mounting table includes a first mounting portion, a second mounting portion, a first adhesive layer, a second adhesive laye...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
09.07.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a mounting table and a plasma processing apparatus. A plurality of adhesive layers having different heights can be protected with one sealing member. The mounting table includes a first mounting portion, a second mounting portion, a first adhesive layer, a second adhesive layer, and a sealing member. The first mounting portion is used for mounting a substrate. The second placing portion is lower than the first placing portion and is used for placing an edge ring surrounding the periphery of the substrate. The first adhesive layer adheres a base and the first placing portion. The second adhesive layer adheres the base and the second placing portion. The sealing member is in contact with the first placing portion at a position above the first adhesive layer, is in contact with the second placing portion at a position above the second adhesive layer, and blocks a space between the first placing portion and the second placing portion by deformation.
本发明提供载置台和等离子体处理装置。能够用一个密封构件保护高度不同的多个粘接层。载 |
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Bibliography: | Application Number: CN202011578696 |