Preparation method of soluble microneedle patch for wound repair
The invention provides a preparation method of a soluble microneedle patch for wound repair. The soluble microneedle patch for wound repair is prepared by using methacrylated hyaluronic acid (MeHA), polyethylene glycol diacrylate (PEGDA) or methacrylated gelatin (GelMA) as main components with a pol...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
06.07.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a preparation method of a soluble microneedle patch for wound repair. The soluble microneedle patch for wound repair is prepared by using methacrylated hyaluronic acid (MeHA), polyethylene glycol diacrylate (PEGDA) or methacrylated gelatin (GelMA) as main components with a polydimethylsiloxane (PDMS) mold copying and ultraviolet curing method, and the prepared microneedle patch is vertical in needle tip, soft in texture, good in elasticity, rich in hyaluronic acid or gelatin content, porous and soluble; the soluble microneedle patch prepared by the invention can be attached to a skin wound surface, and the soft microneedle body is beneficial to protection of the wound surface and alleviation of pain in a treatment process; the porous needle body is beneficial to release of loaded drugs; and the main components of the microneedle can induce angiogenesis and promote epithelial cell differentiation, so as to accelerate the wound healing process. According to the invention, the preparation |
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Bibliography: | Application Number: CN202110373714 |