FILM STACK OVERLAY IMPROVEMENT FOR 3D NAND APPLICATION

• Main Authors: JORAPUR NIKHIL SUDHINDRARAO, BENJAMIN RAJ DAEMIAN RAJ, ADDEPALLI SAI SUSMITA, ROCHA-ALVAREZ JUAN CARLOS, CHICHKANOFF GREGORY EUGENE, OGATA MASAKI, ENSLOW KRISTOPHER, IBRAHIMI ZAKARIA, SRIVASTAVA SHAILENDRA, PADHI DEENESH, BAEK JONG-HOON, GUNG TZA-JING, HAN XINHAI, WANG WENJIAO
• Format: Patent
• Language: Chinese; English
• Published: 29.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY

Embodiments of the disclosure describe an apparatus and a method for depositing a film layer that may have minimum contribution to overlay error after a sequence of deposition and lithographic exposure processes. In one example, a method includes positioning a substrate on a substrate support in a p...