Semiconductor structure and forming method thereof

• Main Authors: HOU SHANGYONG, CHEN WEIMING, DING GUOQIANG
• Format: Patent
• Language: Chinese; English
• Published: 29.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of forming a semiconductor structure includes bonding a first die and a second die to a first side of a first interposer and a first side of a second interposer, respectively, wherein the first interposer is laterally adjacent to the second interposer; sealing the first interposer and the s...