Semiconductor structure and forming method thereof
A method of forming a semiconductor structure includes bonding a first die and a second die to a first side of a first interposer and a first side of a second interposer, respectively, wherein the first interposer is laterally adjacent to the second interposer; sealing the first interposer and the s...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
29.06.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!