SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: LEE MIN-YOUNG, PARK YOUNG-SOO, KIM YOUNG-HO, SON HYUK-JOO, CHOI WOO-JIN, OH JOON-HO, HUR DONG-GEUN
• Format: Patent
• Language: Chinese; English
• Published: 25.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The purpose of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of minimizing thermal deformation of a substrate by blocking between the substrate and a heating unit inside a chamber when loading and unloading the substrate. In order to implement the same, the substrate processing apparatus of the present invention comprises: a chamber in which a heat treatment space for a substrate is arranged; a heating unit provided on the upper portion of the chamber to heat the substrate; a substrate support part which is provided inside the chamber and on which the substrate is placed; and a blocking member located at a blocking position that blocks a space between the heating portion and the substrate and blocks heat transfer of the heating portion to the substrate when the substrate is loaded into the chamber or the substrate inside the chamber is unloaded to the outside. 本发明的目的在于提供一种可以在装载和卸载基板时阻断基板与腔室内部的加热部之间而最小化基板的热变形的基板处理装置以及基板处理方法。为了实现其的本发明的基板处理装置包括：腔室，