Chip mounting method and chip mounting device

• Main Authors: LI DIJIE, LI NANQING, MENG JINHUI, HE HAIDONG
• Format: Patent
• Language: Chinese; English
• Published: 25.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a chip mounting method and a chip mounting device. According to the chip mounting method and the chip mounting device of the invention, angle positioning is performed on a chip before welding of the chip, so that angle deviation between the chip and a substrate is reduced; a linear motor is used for adjusting the positions of the chip and the substrate, and a grating encoder is used for controlling the movement of the linear motor, so that errors caused by mechanical transmission are reduced; and a positioning position and a welding position are arranged at the visual center of a camera positioning device, so that the influence of motion errors on the chip mounting precision caused by the influence of heat generated by mechanical vibration and long-time operation of equipment on the motion precision of the equipment in the chip mounting process is reduced. According to the chip mounting method and the chip mounting device of the invention, the chip mounting precision can be effectively