INDUCTOR ON MICROELECTRONIC DIE

A device (100) has bump bonds (130) and an inductor (140) on a die (102). The device (100) includes first lateral conductors (108) extending along the die (102). Some of the first lateral conductors (108) contact some of the terminals (104) of the die (102). The device (100) also includes conductive...

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Bibliographic Details
Main Author KODURI SREENIVASAN K
Format Patent
LanguageChinese
English
Published 18.06.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
TRANSPORTING
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