INDUCTOR ON MICROELECTRONIC DIE

A device (100) has bump bonds (130) and an inductor (140) on a die (102). The device (100) includes first lateral conductors (108) extending along the die (102). Some of the first lateral conductors (108) contact some of the terminals (104) of the die (102). The device (100) also includes conductive...

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Bibliographic Details
Main Author KODURI SREENIVASAN K
Format Patent
LanguageChinese
English
Published 18.06.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
TRANSPORTING
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Summary:A device (100) has bump bonds (130) and an inductor (140) on a die (102). The device (100) includes first lateral conductors (108) extending along the die (102). Some of the first lateral conductors (108) contact some of the terminals (104) of the die (102). The device (100) also includes conductive columns (114) on the first lateral conductors (108) and second lateral conductors (120) on the conductive columns (114), opposite from the first lateral conductors (108), extending laterally in a plane. A first set (128) of the first lateral conductors (108), the conductive columns (114), and the second lateral conductors (120) provide the bump bonds (130) of the device. A second set (138) of the first lateral conductors (108), the conductive columns (114), and the second lateral conductors (120) are electrically coupled in series to form the inductor (140). Methods of forming the device (100) are also described. 一种装置(100)在裸片(102)上具有凸块接合件(130)及电感器(140)。所述装置(100)包含沿所述裸片(102)延伸的第一侧向导体(108)。所述第一侧向导体(108)中的一些与所述裸片(102
Bibliography:Application Number: CN201980070113