Epoxy molding compound as well as preparation method and application thereof

• Main Authors: LIU CHENGJIE, WANG ZHU, MOU HAIYAN, FAN LANG
• Format: Patent
• Language: Chinese; English
• Published: 18.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention relates to an epoxy molding compound which comprises (a) epoxy resin, (b) phenolic resin, (c) a uring accelerator and (d) an inorganic filler, wherein the epoxy resin comprises a first epoxy resin and an optionally present second epoxy resin, the content of the first epoxy resin is 70 wt% or more based on the total weight of the epoxy resin, and the first epoxy resin is a biphenyl phenol type epoxy resin. The invention also relates to a preparation method of the epoxy molding compound and application of the epoxy molding compound in electronic component packaging. 本发明涉及一种环氧模塑料，其包含：(a)环氧树脂，(b)酚醛树脂，(c)固化促进剂，(d)无机填料；其中所述环氧树脂包含第一环氧树脂和任选存在的第二环氧树脂，基于所述环氧树脂的总重量，所述第一环氧树脂的含量为70重量％以上，并且所述第一环氧树脂为联苯苯酚型环氧树脂。本发明还涉及环氧模塑料的制备方法及其用于电子元器件封装的用途。