Composition and method for chemical copper plating of rare-earth containing nickle-based hydrogen storage alloy

• Main Authors: CHI KE, YU CHENGZHOU, HU ZILONG
• Format: Patent
• Language: English
• Published: 28.08.1996
• Edition: 6
• Subjects: CASTING; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; METALLURGY; PERFORMING OPERATIONS; POWDER METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING; WORKING METALLIC POWDER

The formula of chemical copper-plating liquor for hydrogen-storing alloy powder contains water as solvent, copper salt (0.5-50g/l), acid (0.1-28 ml/l), organic hydroxylcarboxylic acid (2-20 g/l) and La-rich rare-earth. The chemical copper-plating process is as follows: putting hydrogen-storing alloy powder in the copper-plating liquor, stirring for 15-80 min, filtering and baking. Its advantages include less loss of rare-earth in said alloy powder, increasing capacity of said alloy powder, no toxic reagent and pollution and uniform thickness of plated Cu layer.