Composition and method for chemical copper plating of rare-earth containing nickle-based hydrogen storage alloy

The formula of chemical copper-plating liquor for hydrogen-storing alloy powder contains water as solvent, copper salt (0.5-50g/l), acid (0.1-28 ml/l), organic hydroxylcarboxylic acid (2-20 g/l) and La-rich rare-earth. The chemical copper-plating process is as follows: putting hydrogen-storing alloy...

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Bibliographic Details
Main Authors CHI KE, YU CHENGZHOU, HU ZILONG
Format Patent
LanguageEnglish
Published 28.08.1996
Edition6
Subjects
CASTING
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
METALLURGY
PERFORMING OPERATIONS
POWDER METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TRANSPORTING
WORKING METALLIC POWDER
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Summary:The formula of chemical copper-plating liquor for hydrogen-storing alloy powder contains water as solvent, copper salt (0.5-50g/l), acid (0.1-28 ml/l), organic hydroxylcarboxylic acid (2-20 g/l) and La-rich rare-earth. The chemical copper-plating process is as follows: putting hydrogen-storing alloy powder in the copper-plating liquor, stirring for 15-80 min, filtering and baking. Its advantages include less loss of rare-earth in said alloy powder, increasing capacity of said alloy powder, no toxic reagent and pollution and uniform thickness of plated Cu layer.
Bibliography:Application Number: CN1995101640