LITHOGRAPHY SUPPORT CLEANING WITH CLEANING SUBSTRATE HAVING CONTROLLED GEOMETRY AND COMPOSITION
Apparatus for and method of removing a contaminant from a working surface of a lithography support such as a reticle or wafer stage in an EUV or a DUV photolithography system in which a cleaning substrate provided with a coating made a selected material and configuration is pressed against the worki...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
11.06.2021
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Subjects | |
Online Access | Get full text |
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Summary: | Apparatus for and method of removing a contaminant from a working surface of a lithography support such as a reticle or wafer stage in an EUV or a DUV photolithography system in which a cleaning substrate provided with a coating made a selected material and configuration is pressed against the working surface so that the contaminant is transferred from the working surface to the coating.
从EUV或DUV光刻系统中的诸如掩模板平台或晶片平台之类的刻蚀支撑件的工作表面去除污染物的装置和方法,其中将清洁衬底抵靠工作表面按压,清洁衬底设置有由所选材料制成的涂层和配置,使得污染物从工作表面转移到涂层。 |
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Bibliography: | Application Number: CN201980073815 |