POWER SEMICONDUCTOR DEVICE WITH FREE-FLOATING PACKAGING CONCEPT

• Main Authors: GUILLON DAVID, VOBECKY JAN, WIKSTROM TOBIAS MATS OLOF, DOBRZYNSKA JAGODA
• Format: Patent
• Language: Chinese; English
• Published: 01.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

It is provided a power semiconductor device (100) comprising a semiconductor wafer (1) having a junction termination laterally surrounding at least one junction (15). A protection layer (18) covers the lateral side (13) of the semiconductor wafer (1) and a second main side (12) at least in an area (TR) of the junction termination. A first metal disk (2) is arranged on and covers a first main side (11) of the semiconductor wafer (1), wherein the first main side (11) is opposite to the second main side (12). The first metal disk (2) has a lateral size (d2) that is the same as or larger than a lateral size (dW) of the semiconductor wafer (1) to cover the first main side (11) of the semiconductor wafer (1). An interface between the first metal disk (11) and the semiconductor wafer (1) is a free floating interface. 提供了一种功率半导体装置(100)，其包括半导体晶片(1)，该半导体晶片具有在横向上围绕至少一个结(15)的结终端。保护层(18)至少在结终端的区域(TR)中覆盖半导体晶片(1)的横向侧(13)和覆盖第二主侧(12)。第一金属盘(2)被布置并覆盖半导体晶片(1)的第一主侧(11)上，其中，第一主侧(11)与第二主侧(12)相反。第一金属盘(2)具有与半导体晶片(1)的横向尺寸(dW)相同或更大的横向尺