Micro-channel plate evaporated with high-reflection film capable of improving sensitivity, and evaporation method

• Main Authors: LI JIAOJIAO, LI ZHEN, XU YOUYI, MA HUAICHAO, SONG QIGENG, GAO HAIPENG, XU LINGJI, YIN CHANGJUAN, TANG SHUNDA, TAN YUANHANG, GAO BINGXIANG, XIA XIAOJIAO, ZHU HANG, ZHENG LINTAO, YANG XIWEN, LI LEI, LI JINSHA, LI JIABAO
• Format: Patent
• Language: Chinese; English
• Published: 01.06.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention discloses a micro-channel plate evaporated with a high-reflection film capable of improving sensitivity, and an evaporation method. According to the micro-channel plate, a dielectric film is plated on the surface of an input-end conducting layer of the micro-channel plate through a vacuum coating technology, and the input-end conducting layer is covered with the dielectric film; the dielectric film layer not only can cover an input electrode in a channel inlet of the micro-channel plate, but also can cover an input electrode on the surface of an input end of the micro-channel plate; and the dielectric film layer is made of aluminum or silver. The film evaporation method comprises the following steps: putting an evaporation source, namely a silver ingot or an aluminum ingot into a crucible of a film plating machine, performing a film plating procedure when the vacuum degree of the film plating machine reaches 2*10<-5>, filling a vacuum chamber with nitrogen after the film plating procedure is fin