Low-heat-leakage lead structure

The invention is applicable to the field of low-temperature electromagnetism, and discloses a low-heat-leakage lead structure, which comprises a transmitter framework, a transmitter input conducting wire and a transmitter output conducting wire, wherein the transmitter input conducting wire is wound...

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Bibliographic Details
Main Authors WANG JINZHEN, WU JIHAO, BIAN XING
Format Patent
LanguageChinese
English
Published 28.05.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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Summary:The invention is applicable to the field of low-temperature electromagnetism, and discloses a low-heat-leakage lead structure, which comprises a transmitter framework, a transmitter input conducting wire and a transmitter output conducting wire, wherein the transmitter input conducting wire is wound on the transmitter framework by a plurality of turns n1, the transmitter output conducting wire is wound on the transmitter framework by a plurality of turns n2, n1 is greater than n2, the transmitter input conducting wire is provided with a first lead wire end and a second lead wire end, the first lead wire end and the second lead wire end are used for being connected with a room temperature area sensor, the transmitter output conducting wire is provided with a third lead wire end and a fourth lead wire end, and the third lead wire end and the fourth lead wire end are used for being connected with a low temperature area sensor. the low-heat-leakage lead structure can improve the bearing capacity of the input lead
Bibliography:Application Number: CN202110070985