SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Author: OBARA TAKANORI
• Format: Patent
• Language: Chinese; English
• Published: 21.05.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a substrate processing apparatus and a substrate processing method. The operation of the substrate processing apparatus can be reduced, and the time spent on substrate processing can be shortened. The substrate processing apparatus includes: a holder that holds a substrate; a liquid supply that sequentially supplies a first processing liquid and a second processing liquid to a main surface of the substrate held by the holder; a friction body that comes into contact with and rub the main surface of the substrate during the supply of the first processing liquid and the second processing liquid; a mover that moves a contact position of the friction body in a first axial direction and a second axial direction; and a controller that controls the liquid supply and the mover to move the contact position of the friction body in one-side direction of the first axial direction during the supply of the first processing liquid, and move the contact position of the friction body in the other-side