Process control method and device for etching and deposition
The invention discloses an advanced control method and device for etching and deposition. The method comprises the following steps: preparing an airflow distribution plate capable of independently controlling airflow distribution; arranging a plurality of independent micro airflow nozzles on the air...
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| Main Authors | , |
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| Format | Patent |
| Language | Chinese English |
| Published |
21.05.2021
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| Subjects | |
| Online Access | Get full text |
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| Summary: | The invention discloses an advanced control method and device for etching and deposition. The method comprises the following steps: preparing an airflow distribution plate capable of independently controlling airflow distribution; arranging a plurality of independent micro airflow nozzles on the airflow distribution plate in an array mode, wherein each micro airflow nozzle is internally provided with an independent air channel and an electric control switch for controlling the air channel on-off/flow volume and flow rate; and controlling the on-off of each single nozzle through a program according to the process requirement. According to the invention, the uniformity of the air flow/flow velocity of the whole area is ensured through programmable air flow distribution, the control of the programmable air flow pattern and the local area of the air flow velocity is specifically realized, and compared with the existing air flow distribution of the fixed air flow pattern at the fixed air hole position, the atomic |
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| Bibliography: | Application Number: CN201911146409 |